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Thermal Management of Hand-Held Devices Using Thermal Energy Storage
AdvisorWirtz, Richard A
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In this research, a detailed investigation regarding the use of phase change materials (PCM's) as a means of thermal management is performed. The goal is to maintain a portable handheld device's processor temperature (Thermal Interface, TI) below 65°C, while maintaining the device exterior skin temperature below 45°C. The handheld device is expected to dissipate a heat loading of 10W, or a respective 0.15W/cm2 during power-on operation (charge period), while dissipating 0.15mW/cm2 during standby operation (recovery period). Various methods of implementing the use of a PCM in portable electronic devices are explored, and benefits are enumerated. Two main thermal energy storage (TES) systems are considered. The first TES system uses a method of PCM stratification, or stacking of individual PCM layers to optimize the device operating characteristics. A second TES system, or 2-D configuration, uses a PCM with embedded metal filaments to enhance performance and increase thermal conductivity. Each system is analyzed numerically and results are discussed, outlining the key benefits of each. Additionally, an analytical model is created for the 2-D configuration. A dimensional analysis and parametric study are used to determine the effect which various parameters have on system performance.